HKBU Ultra-hard, Anti-scratch Thin Film achieved magnificent result in Geneva

Prof Cheah Kok-wai from the Department of Physics of HKBU and his research team developed a submicron thin film that is ultra-hard, non-fragile and scratch-resistant for use as covers on electronic devices including smartphones and tablets. Compared with the existing less durable and easily scratched glass cover on mobile devices, this non-fragile thin substrate can be applied to screens providing excellent scratch protection. Its manufacturing cost is approximately half that of sapphire covered glass. The fabricated layer can be deposited onto various types of substrate including quartz, fused silica, silicon and even plastic. The fabrication process can be completed using standard industrial deposition processes; therefore production can be scaled-up with minimal development time.


The invention achieved magnificent result at the 44th International Exhibition of Inventions of Geneva in 2016 - the Grand Prix Award (also named the International Invention Award), the gold medal in the Industrial Processes Category and the Special Award for the Invention. In 2016, it won the Seventh Bank of China (HK) FITMI Achievement Award - Certificate of Merit in the Technology Start-up Award. Besides, the invention won Hong Kong Science and Technology Parks Corporation (HKSTP) held the Elevator Pitch Competition - The Champion Across the Globe and Claimed an Investment Prize Worth US$140,000 in 2017.